Adhesive level effect on corrugated board strength – experiment and FE modeling
نویسندگان
چکیده
submitted for the 2007 International Progress in Paper Physics Seminar Adhesive level effect on corrugated board strength – experiment and FE modeling Roman E. Popil, Michael K. Schaepe, Institute of Paper Science and Technology Georgia Institute of Technology, Rami-Haj Ali, Bo-Siou Wei, Joonho Choi, Civil and Environmental Engineering, Georgia Institute of Technology
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